About the Research Conclave
As a concurrent event to the International Summit for the Packaging Industry, the Research Conclave is a dynamic platform designed to spotlight ground breaking research and innovation in packaging. The conclave is dedicated to fostering collaboration between academia and industry, offering students, scholars, and professionals the opportunity to present their research through Oral and Poster Presentations.
Why Participate in the Research Conclave?
- Showcase your research to an audience of industry leaders and innovators.
- Gain recognition through awards and potential publication in the Springer - Journal of Packaging Technology & Research (JPTR).
- Connect with peers and professionals to exchange ideas and insights.
Event Details
Concurrent Events
Date: 8th March 2025
Venue: Eros Hotel, New Delhi
International Summit For Packaging Industry Research Conclave
Abstract Submission Guidelines
To participate in the Research Conclave, submit your abstract adhering to the following guidelines:
- Length: Abstracts must not exceed 250 words.
- Format: Submit in MS Word, using Times New Roman, font size 12, and double spacing.
- Content: Include the title, presenter’s name, affiliation, keywords, and contact details.
For Poster Presentations
- Poster size: 42” x 55”.
- Posters should include the title, presenter’s name, affiliation, keywords, mailing address, and a summary of key findings.
Submission Process
Send your abstracts to: https://iip-ispi.com/regisger/registration.php
- iipdelhi@iip-in.com
Important Notes:
- The 10 best abstracts will be selected for oral presentations.
- Both oral and poster presentations will be judged for awards.
Awards and Recognition
Participants stand a chance to win exciting prizes for their outstanding work:
- 1st Prize : E-Book Coupon worth €250
- 2nd Prize: E-Book Coupon worth €200
- 3rd Prize: E-Book Coupon worth €150
Additionally, the best research paper will be published in the renowned Springer – Journal of Packaging Technology & Research (JPTR), offering global recognition for your work.
Why You Should Join
- Be part of a premier event that blends academia and industry.
- Showcase your research and innovation to global leaders.
- Access invaluable networking opportunities with professionals and peers.
- Gain visibility and recognition for your work in packaging technology.
Contact Information
For more information please visit : www.iip-ispi.com
Join Us to Redefine Packaging for a Sustainable Future!
The Indian Institute of Packaging invites you to a platform where innovation, collaboration, and recognition converge. Don’t miss this opportunity to contribute, connect and lead the change in packaging technology.