Message from Shri N.S. Sundaram

Dear fellow participants,

It gives me great pleasure to welcome you to the 5th International Summit for Packaging Industry (ISPI - 2025) organized by the Indian Institute of Packaging (IIP). I am delighted to be part of this event and to witness the latest trends and technologies in packaging.

The theme of 5S Packaging, namely Safe, Secure, Standardized, Smart and Sustainable Packaging, is highly relevant in today's context. With the increasing demand for packaged goods, it is imperative to ensure that packaging is safe for the consumers, secure during transportation, and sustainable for the environment. The three days of the summit will provide an excellent platform for experts from India and overseas to share their knowledge and insights on the latest trends and technologies in the packaging industry.

The Indian Institute of Packaging (IIP) has been at the forefront of improving the standards of packaging in the country since its inception in 1966. The institute's diverse range of activities, which includes research and development, education, training, testing, information, consultancy, exhibition, designs, publication, library, and database services, is a testament to its commitment to improving the packaging industry.

I am confident that the three days of the ISPI 2025 International Summit will be a fruitful and enriching experience for all the participants. I congratulate the Indian Institute of Packaging (IIP) for organizing this event and wish them all the success.

Best regards,
Shri N.S. Sundaram
ISPI 2025 Chairman