Message from Shri Sunil Jain

I am pleased to extend my warm greetings to all of you on the occasion of the three days 5th International Summit organized by the Indian Institute of Packaging (IIP). The theme of this event, Packaging 5S: Safe, Secure, Standardized, Smart, and Sustainable Packaging - is of immense importance in today's world, where packaging plays a critical role in ensuring the safety of products and the preservation of our environment.

The main objective of the three days Summit is to highlight the latest trends and technologies of various packaging materials, conversion technologies, packaging machineries with automation to increase the productivity and to reduce the wastage, as well as to meet the requirement of the packaging user industry to satisfy the demands of modern consumers. The various topics will be covered by the galaxy of speakers from India and overseas who would deliver the presentations around the theme.

The main focus of this Summit is to showcase innovations in Packaging Materials, Technologies, Techniques, and Machineries. An array of eminent speakers will be sharing their knowledge through their presentations. It provides an interactive platform among industry experts.

I express my sincere and best wishes to IIP Delhi for the 5th International Summit with the theme of Packaging 5S and wish them all success.

Best regards,
Shri Sunil Jain
Chairman, IIP